US Patent Issued to TEXAS INSTRUMENTS on May 6 for "Flip chip semiconductor device package with mold compound seal" (Texas Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,948, issued on May 6, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Flip chip semiconductor device package with mold compound seal" was invented by Amit Sureshkumar Nangia (Murphy, Texas) and Gregory Thomas Ostrowicki (Dallas).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a described example, an apparatus includes: a semiconductor die with a component on a device side surface; a die seal surrounding the component on the device side surface; a package substrate having bond pads on a die side surface; a package substrate seal formed on the die side surface of the package substrate corresponding to the die seal on the semiconductor die; the semi...