ALEXANDRIA, Va., June 10 -- United States Patent no. 12,293,953, issued on May 6, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Edge bend for isolation packages" was invented by John Paul Tellkamp (Rockwall, Texas) and Chang-Yen Ko (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor isolation package includes a leadframe that includes a plurality of leadframe leads. At least one of the plurality of leadframe leads includes a lead body having a first end that comprises an external pin portion and a second end. The lead body has a leg portion coupled to a central lead portion that is coupled to an edge bend portion. The edge bend portion is formed by a first bend on the lead body...