ALEXANDRIA, Va., June 17 -- United States Patent no. 12,312,703, issued on May 27, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Neutral pH copper plating solution for undercut reduction" was invented by Nazila Dadvand (Richardson, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic device is formed by forming a seed layer that contains primarily zinc. A plating mask is formed over the seed layer, and a copper strike layer is formed on the seed layer using a neutral pH copper plating bath. A main copper layer is formed on the copper strike layer by plating copper on the copper strike layer. The plating mask is subsequently removed. The main copper layer, the copper strike layer, and th...