ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,678, issued on May 13, was assigned to Texas Instruments Inc. (Dallas).
"Package for power semiconductor devices" was invented by Sreenivasan K. Koduri (Dallas), Steven R. Tom (Dallas) and Paul Brohlin (Parker, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "In a described example, an apparatus includes: a first mold compound partially covering a thermal pad that extends through a pre-molded package substrate formed of a first mold compound, a portion of the thermal pad exposed on a die side surface of the pre-molded package substrate, the pre-molded package substrate having a recess on the die side surface, with an exposed portion of the therm...