US Patent Issued to TEXAS INSTRUMENTS on March 4 for "Package substrate with CTE matching barrier ring around microvias" (Texas Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,835, issued on March 4, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Package substrate with CTE matching barrier ring around microvias" was invented by Jaimal Mallory Williamson (McKinney, Texas) and Guangxu Li (Allen, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-layer package substrate includes a first build-up layer including a first dielectric layer and at least a second build-up layer including a second dielectric layer on the first build-up layer. The second build-up layer includes a top metal layer with a surface configured for attaching at least one integrated circuit (IC) die. The first build-up layer includes a bottom m...