ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,911, issued on March 4, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Integrated circuit package for isolation dies" was invented by Matthew David Romig (Allen, Texas), Enis Tuncer (Dallas), Rajen Manicon Murugan (Dallas) and Yiqi Tang (Allen, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "In described examples of an isolation device, an isolation die that has a set of bond pads is mounted on a first lead frame that has a set of leads. A portion of the bond pads are coupled to respective leads. A first mold material encapsulates the isolation device and the first lead frame forming a first package. The first package is mounted on a second ...