US Patent Issued to TEXAS INSTRUMENTS on March 25 for "IC device with chip to package interconnects from a copper metal interconnect level" (Texas Inventor)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,261,141, issued on March 25, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"IC device with chip to package interconnects from a copper metal interconnect level" was invented by Manoj Kumar Jain (Plano, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit device (100) and method comprising an IC chip (102) having metal interconnect levels (M1-Mn) including a last copper interconnect level (Mn) and a chip-to-package interconnect (110) overlying and connected to the last copper interconnect level (Mn). The chip-to-package interconnect (110) having a via (112) connected to a first element (306a) of the last copper interconnect leve...