US Patent Issued to TEXAS INSTRUMENTS on March 25 for "Hall sensor using face down structure with through substrate vias" (Japanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,259,445, issued on March 25, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Hall sensor using face down structure with through substrate vias" was invented by Daiki Komatsu (Beppu, Japan) and Masamitsu Matsuura (Beppu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) package comprises a semiconductor die having a first surface with a Hall-effect sensor circuit and a second surface. A plurality of through substrate vias (TSV) each having a metal layer extend from the first surface of the semiconductor die to the second surface. The IC package includes a portion of a leadframe having a first set of leads and a second set...