US Patent Issued to TEXAS INSTRUMENTS on March 18 for "Splash resistant laser wafer singulation by crack length control" (Chinese, Philippine, American Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,097, issued on March 18, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Splash resistant laser wafer singulation by crack length control" was invented by Yang Liu (Sichuan, China), Hao Zhang (Sichuan, China), Venkataramanan Kalyanaraman (Allen, Texas), Joseph O Liu (Plano, Texas), Qing Ran (Sichuan, China), Yuan Zhang (Sichuan, China), Gelline Joyce Untalan Vargas (Marikina, Philippines) and Jeniffer Otero Aspuria (Baguio, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of dicing a wafer includes positioning the wafer with its top side on a tape material. The wafer includes a plurality of die separated by scribe streets. A fi...