US Patent Issued to TEXAS INSTRUMENTS on March 18 for "Method for creating a wettable surface for improved reliability in QFN packages" (Texas Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,077, issued on March 18, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Method for creating a wettable surface for improved reliability in QFN packages" was invented by Sadia Naseem (Dallas) and Vikas Gupta (Dallas).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosed principles provide for implementing low-cost and fast metallic printing processes into the QFN and other no-leads package assembly flow to selectively print solderable material in areas that would otherwise be susceptible to corrosion and thus pose reliability risks. The problem of copper corrosion and poor BLR performance in no-leads packages because of remaining exposed co...