US Patent Issued to TEXAS INSTRUMENTS on March 18 for "Electronic devices in semiconductor package cavities" (Texas Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,255,115, issued on March 18, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Electronic devices in semiconductor package cavities" was invented by Christopher Daniel Manack (Flower Mound, Texas), Patrick Francis Thompson (Allen, Texas) and Qiao Chen (Flower Mound, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "In examples, a semiconductor device comprises a semiconductor package including a mold compound covering a semiconductor die. The semiconductor package has a surface and a cavity formed in the surface. The semiconductor device comprises an electronic device positioned within the cavity, the electronic device coupled to the semiconductor d...