US Patent Issued to TEXAS INSTRUMENTS on June 3 for "Antenna in package having antenna on package substrate" (American, Chinese Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,856, issued on June 3, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Antenna in package having antenna on package substrate" was invented by Yiqi Tang (Allen, Texas), Makarand Ramkrishna Kulkarni (Dallas), Liang Wan (Chengdu, China) and Rajen Manicon Murugan (Dallas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An antenna in package (AIP) 400 includes an IC die 120 including bond pads 121 and a package substrate including the IC die mounted up and being completely embedded therein. The package substrate includes a top layer 418 including a top dielectric layer 418b, a top metal layer 418a including an antenna 418a1, and a bottom layer 415 includ...