ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,126, issued on June 24, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Bump to package substrate solder joint" was invented by Dolores Milo (Baguio, Philippines), Michael Milo (Baguio, Philippines) and Allen Dee (Baguio, Philippines).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of assembling a flipchip semiconductor package, includes placing a semiconductor die having circuitry electrically coupled to bond pads with bumps having solder paste thereon onto bonding features of a package substrate. Arc welding is used using an arc welding apparatus including a biased electrode having a tip spaced apart from the solder paste, wherein electri...