US Patent Issued to TEXAS INSTRUMENTS on June 17 for "Leaded semiconductor device package having leads with different widths" (Japanese Inventor)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,417, issued on June 17, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Leaded semiconductor device package having leads with different widths" was invented by Masamitsu Matsuura (Beppu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a described example, an apparatus includes: a package substrate having a die pad configured for receiving a semiconductor die, and having conductive leads spaced from the die pad; a semiconductor die mounted on the die pad, the semiconductor die having bond pads on an active surface configured for making electrical connections; electrical connections coupling the bond pads of the semiconductor die to the cond...