US Patent Issued to TEXAS INSTRUMENTS on June 10 for "Multilayer package substrate with improved current density distribution" (Texas, Georgia Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,736, issued on June 10, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Multilayer package substrate with improved current density distribution" was invented by Yiqi Tang (Allen, Texas), Rajen Murugan (Dallas), Phuong Minh Vu (Atlanta) and Sylvester Ankamah-Kusi (Dallas).

According to the abstract* released by the U.S. Patent & Trademark Office: "Described examples include a method having steps of laying out at least two conductors and modeling conductor current through the at least two conductors to determine a current density in the at least two conductors. The method also has steps of revising the at least two conductors as adjusted conductors to add conductive material to a...