US Patent Issued to TEXAS INSTRUMENTS on July 8 for "Package geometries to enable visual inspection of solder fillets" (Chinese Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,354,918, issued on July 8, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Package geometries to enable visual inspection of solder fillets" was invented by LongTing Li (ChengDu, China) and HuoYun Duan (ChengDu, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "In examples, a method of manufacturing a semiconductor package comprises providing an array of unsingulated semiconductor packages, the array having a bottom surface and a conductive terminal exposed to the bottom surface, the conductive terminal including a slot configured to receive solder material. The method includes coupling a tape to the array of unsingulated semiconductor packages and ...