US Patent Issued to TEXAS INSTRUMENTS on July 22 for "Methods and apparatus for electronic device packaging" (American, Taiwanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,365,584, issued on July 22, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Methods and apparatus for electronic device packaging" was invented by Jane Liu (Plano, Texas), Richard Chen (Taoyuan, Taiwan) and William R. Morrison (Dallas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An example method of producing a microelectromechanical system (MEMS) package, the method comprising: applying first epoxy layers to a first substrate, at least one of the first epoxy layers coupled to a second substrate; applying a first post gel heat treatment to the first epoxy layers; after applying the first post gel heat treatment to the first epoxy layers, applying se...