ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,738, issued on July 1, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Sensor package cavities with polymer films" was invented by Sreenivasan Kalyani Koduri (Dallas) and Leslie Edward Stark (Heath, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "In examples, a sensor package includes a semiconductor die, a sensor on the semiconductor die, and a mold compound covering the semiconductor die. The mold compound includes a sensor cavity over the sensor. The sensor package includes a polymer film member on the sensor and circumscribed by a wall of the mold compound forming the sensor cavity. The polymer film member is exposed to an exterior environ...