US Patent Issued to TEXAS INSTRUMENTS on July 1 for "IC package with heat spreader" (Texas, California Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,742, issued on July 1, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"IC package with heat spreader" was invented by Rongwei Zhang (Plano, Texas), Woochan Kim (San Jose, Calif.) and Patrick Francis Thompson (Allen, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) package includes a molding having a first surface and a second surface, the first surface opposing the second surface. An interconnect is encased in the molding. The interconnect includes pads situated at a periphery of a side of the IC package. A portion of the pads are exposed at the first surface of the molding. A die pad is situated proximal to the secon...