US Patent Issued to TEXAS INSTRUMENTS on Jan. 20 for "Semiconductor device package with vertically stacked passive component" (Japanese, American Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,786, issued on Jan. 20, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Semiconductor device package with vertically stacked passive component" was invented by Makoto Shibuya (Tokyo) and Kwang-Soo Kim (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a described example, an apparatus includes: a package substrate with conductive leads; a semiconductor die mounted to the package substrate, the semiconductor die having a first thickness; electrical connections coupling bond pads on the semiconductor die to conductive leads on the package substrate; brackets attached to the package substrate spaced from the semiconductor die and ex...