ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,500, issued on Jan. 13, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Coated semiconductor dies" was invented by Michael Todd Wyant (Dallas), Matthew John Sherbin (Dallas), Christopher Daniel Manack (Flower Mound, Texas), Patrick Francis Thompson (Allen, Texas) and You Chye How (Melaka, Malaysia).
According to the abstract* released by the U.S. Patent & Trademark Office: "In examples, a chip scale package (CSP) comprises a semiconductor die; a conductive terminal coupled to the semiconductor die; and a non-conductive coat covering a backside of the semiconductor die and a sidewall of the semiconductor die. The non-conductive coat has a thickness of less than 45 microns."
The...