US Patent Issued to TEXAS INSTRUMENTS on Jan. 13 for "Automated overlay removal during wafer singulation" (Texas Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,444, issued on Jan. 13, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Automated overlay removal during wafer singulation" was invented by Andrew Nelson (Van Alstyne, Texas), John C. Ehmke (Longview, Texas), Daryl R. Koehl (Garland, Texas) and Nathan Bays (Rowlett, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some examples, a device comprises a wafer chuck, a member having a surface facing the wafer chuck, a blade supported by the surface, a first vacuum nozzle extending through the member and having a first vacuum orifice facing a same direction as the surface, and a second vacuum nozzle extending through the member and having a secon...