US Patent Issued to TEXAS INSTRUMENTS on Feb. 4 for "Package substrate having integrated passive device(s) between leads" (Texas Inventors)

ALEXANDRIA, Va., Feb. 5 -- United States Patent no. 12,218,036, issued on Feb. 4, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Package substrate having integrated passive device(s) between leads" was invented by Rajen Manicon Murugan (Dallas) and Yiqi Tang (Allen, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a multilayer package substrate with a top layer including top filled vias through a top dielectric layer and top metal layer providing a top surface for leads and traces connected to the leads, and a bottom layer including bottom filled vias including contact pads through a bottom dielectric and metal layer. The top filled vias are for connecting the bottom a...