ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,237,249, issued on Feb. 25, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Substrates with solder barriers on leads" was invented by Bernardo Gallegos (McKinney, Texas) and Madison Koziol (Richardson, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "A system comprises a substrate. The substrate comprises a lead. The system also comprises a solder barrier formed on the lead. The solder barrier is to contain a solder bump within a solder area on the lead. The system further includes a solder bump in the solder area and a die having an active surface coupled to the solder bump."
The patent was filed on Oct. 30, 2018, under Application No. 16/175,27...