US Patent Issued to TEXAS INSTRUMENTS on Feb. 18 for "Wafer chip scale packaging with ball attach before repassivation" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,539, issued on Feb. 18, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Wafer chip scale packaging with ball attach before repassivation" was invented by Daiki Komatsu (Beppu, Japan) and Makoto Shibuya (Beppu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed examples provide methods that include forming a conductive structure at least partially above a conductive feature of a wafer, attaching a solder ball structure to a side of the conductive structure, and thereafter forming a repassivation layer on a side of the wafer proximate the side of the conductive structure. Further examples provide microelectronic devices and integrated ci...