US Patent Issued to TEXAS INSTRUMENTS on Feb. 18 for "Printed package and method of making the same" (Texas Inventor)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,594, issued on Feb. 18, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Printed package and method of making the same" was invented by Sreenivasan K. Koduri (Dallas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for interconnecting bond pads of semiconductor dies or devices with corresponding leads in a lead frame with printed conductive interconnects in lieu of bond wires and an apparatus resulting from the above method. More specifically, some examples include printing an insulating foundation path from bond-pads on a semiconductor die to leads of a lead frame to which the semiconductor die is attached. A foundation conductive trace is ...