ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,771, issued on Feb. 10, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Double stitch wirebonds" was invented by Xiaolin Kang (Chengdu, China), Ziqi Wang (Chengdu, China), Huoyun Duan (Chengdu, China), Peng Peng (Chengdu, China), Ye Zhuang (Chengdu, China), Xiaoling Kang (Chengdu, China) and Hongxia Deng (Chengdu, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "In some examples, a semiconductor package comprises an electrically conductive surface and a bond wire coupled to the electrically conductive surface. The bond wire includes a first stitch bond coupled to the electrically conductive surface, and a second stitch bond contiguous with the...