US Patent Issued to TEXAS INSTRUMENTS on Dec. 9 for "Multi-layer semiconductor package with stacked passive components" (American, Chinese Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,450, issued on Dec. 9, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Multi-layer semiconductor package with stacked passive components" was invented by Yiqi Tang (Allen, Texas), Naweed Anjum (Murphy, Texas), Liang Wan (Chengdu, China) and Michael Gerald Amaro (Naperville, Ill.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first layer including a semiconductor die embedded within a dielectric substrate, and a first set of metal pillars extending through the dielectric substrate, a second layer stacked on the first layer, the second layer including a metal trace patterned on the dielectric substrate of the first ...