ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,434, issued on Dec. 30, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Semiconductor package for stress isolation" was invented by Gregory Ostrowicki (Dallas), Amit Nangia (Murphy, Texas) and Kashyap Mohan (Irving, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "In examples, a semiconductor package comprises a substrate having multiple conductive layers coupled to bond pads at a surface of the substrate. The package includes a semiconductor die including a device side facing the substrate, the device side having first and second circuitry regions, the first circuitry region having greater sensitivity to at least one of mechanical or thermal ...