US Patent Issued to TEXAS INSTRUMENTS on Dec. 30 for "Plated walls defining mold compound cavities" (Philippine Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,381, issued on Dec. 30, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Plated walls defining mold compound cavities" was invented by John Carlo Cruz Molina (Limay, Philippines), Julian Carlo Concepcion Barbadillo (Mabalacat, Philippines) and Ray Fredric Solis De Asis (Mabalacat, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "In examples, a semiconductor package comprises a wafer chip scale package (WCSP) having circuitry formed in a device side and an insulative layer above the device side. The WCSP includes one or more plated walls extending vertically to form a defined space, the one or more plated walls configured to prevent mold c...