ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,416, issued on Dec. 30, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Laser ablation for die separation to reduce laser splash and electronic device" was invented by Michael Todd Wyant (Dallas), Joseph O. Liu (Plano, Texas) and Christopher Daniel Manack (Flower Mound, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes performing a laser ablation process that removes a portion of a wafer to form a trench in a scribe region between adjacent die regions of the wafer, the trench extending from a first side of the wafer toward an opposite second side of the wafer, the trench extending through a metallization structure and an activ...