US Patent Issued to TEXAS INSTRUMENTS on Dec. 23 for "Expanded head pillar for bump bonds" (Texas Inventor)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,097, issued on Dec. 23, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Expanded head pillar for bump bonds" was invented by Sreenivasan K. Koduri (Allen, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectronic device has a bump bond structure including an electrically conductive pillar with an expanded head, and solder on the expanded head. The electrically conductive pillar includes a column extending from an I/O pad to the expanded head. The expanded head extends laterally past the column on at least one side of the electrically conductive pillar. In one aspect, the expanded head may have a rounded side profile with a radius appr...