US Patent Issued to TEXAS INSTRUMENTS on Dec. 2 for "Semiconductor package substrate with a smooth groove straddling topside and sidewall" (Taiwanese, German Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,037, issued on Dec. 2, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Semiconductor package substrate with a smooth groove straddling topside and sidewall" was invented by Bob Lee (New Taipei, Taiwan) and Kim Hong Lucas Chai (Dresden, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a metallic substrate, the metallic substrate including a roughened surface, a semiconductor die including bond pads, and an adhesive between the roughened surface of a topside of the metallic substrate and the semiconductor die, therein bonding the semiconductor die to the metallic substrate. The adhesive includes a resin. The met...