US Patent Issued to TEXAS INSTRUMENTS on Dec. 2 for "Semiconductor device with multiple dies" (Texas Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,061, issued on Dec. 2, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Semiconductor device with multiple dies" was invented by Yiqi Tang (Allen, Texas) and Rajen Manicon Murugan (Dallas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first die having ports and a second die having ports. The semiconductor device includes a multi-layer package substrate. The multi-layer package substrate includes a first layer patterned to include pads for the ports of the first die and the second die and a second layer patterned to provide vias between the pads for the ports of the first die and pads for the ports of the second die ...