US Patent Issued to TEXAS INSTRUMENTS on Dec. 2 for "Electronic device and multilevel package substrate with integrated filter" (Texas Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,070, issued on Dec. 2, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Electronic device and multilevel package substrate with integrated filter" was invented by Sylvester Ankamah-Kusi (Dallas), Yiqi Tang (Allen, Texas), Siraj Akhtar (Richardson, Texas) and Rajen Murugan (Dallas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a multilevel package substrate, a semiconductor die, and a package structure, the multilevel package substrate having a first level, a second level, and a filter circuit in the first and second levels. The filter circuit includes a filter input terminal, a first capacitor, a first inductor, a secon...