ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,082, issued on Dec. 16, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Semicondctor device package thermal conduit" was invented by Archana Venugopal (Dallas), Benjamin Stassen Cook (Rockwall, Texas), Luigi Colombo (Dallas) and Robert Reid Doering (Garland, Texas).
According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged electronic device includes an integrated circuit and an electrically non-conductive encapsulation material in contact with the integrated circuit. A thermal conduit extends from an exterior of the package, through the encapsulation material, to the integrated circuit. The thermal conduit has a thermal conductivity higher than the ...