US Patent Issued to TEXAS INSTRUMENTS on Aug. 5 for "Electronic device and multilevel package substrate with elevated trace features for solder and/or die confinement and method for fabricating the electronic device" (Texas Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,139, issued on Aug. 5, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Electronic device and multilevel package substrate with elevated trace features for solder and/or die confinement and method for fabricating the electronic device" was invented by Yiqi Tang (Allen, Texas), Guangxu Li (Allen, Texas) and Rajen Manicon Murugan (Dallas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device with a multilevel package substrate having multiple levels including a first level having conductive leads and a final level having conductive landing areas along a side, as well as a die mounted to the multilevel package substrate and having conducti...