US Patent Issued to TEXAS INSTRUMENTS on Aug. 26 for "Packaged semiconductor device including heat slug" (California Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,939, issued on Aug. 26, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Packaged semiconductor device including heat slug" was invented by Ken Pham (San Jose, Calif.), Vivek Arora (San Jose, Calif.) and Woochan Kim (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "This description relates generally to semiconductor devices and processes. A method for forming a packaged semiconductor package can include attaching a front side of a metal layer to a die pad of a leadframe that includes conductive terminals, so a periphery portion of the metal layer extends beyond a periphery pad surface of the die pad, and a portion of a half-etched ca...