US Patent Issued to TEXAS INSTRUMENTS on Aug. 26 for "Electronic device multilevel package substrate for improved electromigration performance" (Texas Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,945, issued on Aug. 26, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Electronic device multilevel package substrate for improved electromigration performance" was invented by Sylvester Ankamah-Kusi (McKinney, Texas), Yiqi Tang (Allen, Texas), Rajen Manicon Murugan (Dallas) and Sreenivasan K. Koduri (Dallas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes a multilevel package substrate with first and second levels extending in planes of first and second directions and spaced apart from one another along a third direction, the first level having a first side with landing areas spaced apart from one another along the fi...