US Patent Issued to TEXAS INSTRUMENTS on Aug. 19 for "Efficient removal of street test devices during wafer dicing" (Texas Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,671, issued on Aug. 19, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Efficient removal of street test devices during wafer dicing" was invented by Michael Todd Wyant (Dallas), Joseph Liu (Dallas) and Christopher Daniel Manack (Flower Mound, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some examples, a method for manufacturing a semiconductor package comprises coupling a photoresist layer to a non-device side of a semiconductor wafer, the semiconductor wafer having a device side, first and second circuits formed in the device side and separated by a scribe street, a test device positioned in the scribe street. The method also comprise...