US Patent Issued to TEXAS INSTRUMENTS on April 8 for "Conductive members atop semiconductor packages" (Japanese, American Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,272,626, issued on April 8, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Conductive members atop semiconductor packages" was invented by Makoto Shibuya (Tokyo), Masamitsu Matsuura (Beppu, Japan), Kengo Aoya (Beppu, Japan) and Anindya Poddar (Sunnyvale, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some examples, a semiconductor package comprises a semiconductor die including a device side having a circuit; a mold compound covering the semiconductor die and the circuit; a first lead coupled to the circuit, the first lead having a gullwing shape and emerging from the mold compound in a first horizontal plane, the first lead having a distal...