US Patent Issued to TEXAS INSTRUMENTS on April 29 for "Flip chip package assembly having post connects with solder-based joints" (Philippine Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,288,763, issued on April 29, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Flip chip package assembly having post connects with solder-based joints" was invented by Rafael Jose Lizares Guevara (Manila, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "A described example includes: a semiconductor die having bond pads on a device side surface; a passivation layer overlying the device side surface of the semiconductor die with openings in the passivation layer, the passivation layer having a planar surface facing away from the device side surface of the semiconductor die; post connects formed on the bond pads and in the openings in the passiva...