US Patent Issued to TEXAS INSTRUMENTS on April 22 for "Copper wire bond on gold bump on semiconductor die bond pad" (Chinese Inventors)

ALEXANDRIA, Va., June 6 -- United States Patent no. 12,283,559, issued on April 22, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Copper wire bond on gold bump on semiconductor die bond pad" was invented by Lin Zhang (Chengdu, China), Huo Yun Duan (Chengdu, China), Xi Lin Li (Chengdu, China), Chen Xiong (Chengdu, China) and Xiao Lin Kang (Chengdu, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a conductive pad, a semiconductor die with an aluminum bond pad over a dielectric layer of the semiconductor die, a gold bump on the aluminum bond pad, a first intermetallic layer of gold and aluminum between the aluminum bond pad and the gold bump, a copper ball bond on the g...