US Patent Issued to TEXAS INSTRUMENTS on April 1 for "Semiconductor die with solder restraining wall" (Philippine Inventors)

ALEXANDRIA, Va., April 2 -- United States Patent no. 12,266,624, issued on April 1, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).

"Semiconductor die with solder restraining wall" was invented by John Carlo Cruz Molina (Limay, Philippines) and Rafael Jose Lizares Guevara (Manila, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die includes a semiconductor surface including circuitry electrically connected to top-level bond pads exposed on a top surface of the semiconductor die, the top-level bond pads including inner bond pads and outer bond pads positioned beyond the inner bond pads. There is solder on at least the inner bond pads. A ring structure is positioned around a locatio...