ALEXANDRIA, Va., April 2 -- United States Patent no. 12,266,631, issued on April 1, was assigned to TEXAS INSTRUMENTS Inc. (Dallas).
"Flip-chip package assembly" was invented by Rafael Jose Lizares Guevara (Angeles, Philippines), John Carlo Cruz Molina (Limay, Philippines) and Steffany Ann Lacierda Moreno (Bamban, Philippines).
According to the abstract* released by the U.S. Patent & Trademark Office: "In a described example, a method includes: forming cavities in a die mount surface of a package substrate, the cavities extending into the die mount surface of the package substrate at locations corresponding to post connects on a semiconductor die to be flip-chip mounted to the package substrate; placing flux in the cavities; placing solde...