US Patent Issued to TENCENT TECHNOLOGY (SHENZHEN) on Jan. 13 for "Qubit assembly preparation method, qubit assembly, quantum chip, and device" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,524,697, issued on Jan. 13, was assigned to TENCENT TECHNOLOGY (SHENZHEN) COMPANY LTD (Shenzhen, China).

"Qubit assembly preparation method, qubit assembly, quantum chip, and device" was invented by Wenlong Zhang (Shenzhen, China) and Maochun Dai (Shenzhen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A qubit assembly preparation method includes preparing a waveguide film in two or more regions on a substrate spaced apart from each other. The method further includes preparing, by using a Dolan bridge photoresist structure, a qubit structure not connected to the waveguide film. The qubit structure includes a three-layer structure. The three-layer...