US Patent Issued to TEMNEST on Sept. 30 for "Electrostatic chuck and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,380, issued on Sept. 30, was assigned to TEMNEST INC. (Hwaseong-si, South Korea).

"Electrostatic chuck and method of manufacturing the same" was invented by Hae Ran Kim (Hwaseong-si, South Korea), Young Jae Jeon (Yongin-si, South Korea) and Jae Hyun Lee (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to an electrostatic chuck and a method of manufacturing the same. A problem in that the yield of a wafer is reduced due to a partial destruction phenomenon attributable to thermal expansion of an electrostatic chuck is solved and the lifespan of a wafer is increased by making a coefficient of therma...