ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,209,012, issued on Jan. 28, was assigned to Teknologian tutkimuskeskus VTT Oy (Espoo, Finland).
"Wafer level package for device" was invented by Jae-Wung Lee (Espoo, Finland).
According to the abstract* released by the U.S. Patent & Trademark Office: "According to an example aspect of the present invention, there is provided a wafer level package for a device, the package comprising: a first substrate and a second substrate, a sealing structure comprising a seal ring and a bonding layer between the first substrate and the second substrate, and a lateral electrical connection line on a surface of the first substrate, which lateral electrical connection line extends through the seal ri...