US Patent Issued to Technical institute of physics and chemistry of the chinese academy of sciences, Beijing CAS Microneedle Technology on May 27 for "Hydrogel microneedle patch based on three-dimensional framework structure, and preparation method and application thereof" (Chinese Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,311,137, issued on May 27, was assigned to Technical institute of physics and chemistry of the chinese academy of sciences (Beijing) and Beijing CAS Microneedle Technology Ltd. (Beijing).

"Hydrogel microneedle patch based on three-dimensional framework structure, and preparation method and application thereof" was invented by Yunhua Gao (Beijing) and Mengzhen Xing (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A hydrogel microneedle patch based on a three-dimensional framework structure is provided and includes a hydrogel microneedle. A raw material of the hydrogel microneedle includes polyvinyl alcohol and aqueous dispersion of acrylic resin. ...