US Patent Issued to TE CONNECTIVITY SOLUTIONS on Sept. 9 for "Wafer assembly for electrical connector assemblies" (Pennsylvania, New Jersey Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,413,025, issued on Sept. 9, was assigned to TE CONNECTIVITY SOLUTIONS GmbH (Schaffhausen, Switzerland).

"Wafer assembly for electrical connector assemblies" was invented by Michael Streckewald (Harrisburg, Pa.), Justin Dennis Pickel (Hummelstown, Pa.), Julia Anne Lachman (York, Pa.) and Chad William Morgan (Carneys Point, N.J.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer assembly includes a leadframe having signal contacts and cables with signal conductors terminated to the corresponding signal contacts. Each cable includes a cable shield providing shielding for the signal conductors. The wafer assembly includes a wafer body holding the signa...